Publications & Patents

Artificial Vision & Neural Engineering

Conferences
Wafer-bonded capacitive micromachined ultrasonic transducers for ultrasound imaging
Author
Shinyong Shim, Dong-Hyun Kang, Seonghun Cho, Maesoon Im, Burtus T. Khuri-Yakub, Jae-Woong Jeong, and Byung Chul Lee
Conference name
The 23rd Korean Micro Electro Mechanical Systems Conference (KMEMS’21), TO-3-04
Location
Buyeo, South Korea
Conference date
Apr. 7-9, 2021