목록 Wafer-bonded capacitive micromachined ultrasonic transducers for ultrasound imaging Author Shinyong Shim, Dong-Hyun Kang, Seonghun Cho, Maesoon Im, Burtus T. Khuri-Yakub, Jae-Woong Jeong, and Byung Chul Lee Conference name The 23rd Korean Micro Electro Mechanical Systems Conference (KMEMS’21), TO-3-04 Location Buyeo, South Korea Conference date Apr. 7-9, 2021