Method of packaging neural signal recording device with various array structure microelectrodes using anisotropically-conductive adhesive and SUS mask

Author

Chaesung Kim, Hyeonhee Roh, Jungjun Kim, Hyejeong Seong, and Maesoon Im

Conference name

The 25th Korean Micro Electro Mechanical Systems Conference (KMEMS’23)

Location

Jeju, South Korea

Conference date

Mar. 22-24, 2023.